2020(第三届)中国消费电子胶粘材料技术与应用创新论坛

一、会议议程

时间
Time

演讲主题
Topic

演讲人
Speaker

09:00-10:00

签到
Registration

10:00-10:10

开幕致辞
Opening speech

主办单位/赞助单位
Organizer/Sponsor

10:10-10:40

高强度可拆卸聚氨酯胶的设计及在消费电子行业应用
The Design of High-Strength Removable Polyurethane Adhesive and Its Application in Consumer Electronics Industry

傅和青
教授,华南理工大学

Heqing Fu
Professor,South China University of Technology

10:40-11:10

三防涂覆材料在PCB上的应用
The Application of Three Proofing Coating Materials for PCB

邓剑生
高级产品经理,回天新材

Jiansheng Deng
Senior Product Manager,Huitian New Material

11:10-11:40

柔软可压缩高导热绝缘导热硅凝胶的制备及在5G手机应用
The Manufacturing of Soft, Compressible, High Heat Conductive,and Thermally Conductive Insulating Silicone Gel and Its Application for 5G mobile phones

刘金明
高工/总工程师,集泰股份兆舜科技(广东)有限公司

Jinming Liu
Senior Engineer/Chief Engineer,Zhaoshun Technology (Guangdong) Co., Ltd, Jointas

11:40-12:00

5G热管理材料的分子工程设计及其应用 
The Molecular Engineering Design and Application of 5G Thermal Management Materials

倪卓
教授,深圳大学

Zhuo Ni
Professor,Shenzhen University

12:00-13:30

午休
Break

13:30-14:00

新型UV丙烯酸酯热熔压敏胶在电子胶带上的应用研究 
Application and Research of New UV Hot Melt Acrylic Pressure-Sensitive Adhesive in terms of Electronic Tape

林政鍊
常务副总经理,东莞市成铭胶粘剂有限公司

Zhenglian Lin
Executive Deputy General Manager ,DONGGUAN CO-MO ADHESIVES CO., LTD.                       

14:00-14:30

耐高温含酰亚胺环结构树脂体系构建及在结构/功能胶粘剂方面的应用优势
The Construction of High Temperature Resistant Resin System Containing Imide Ring and Its Application Advantages in terms of Structure / Functional Adhesives

刘长威
博士,黑龙江省科学院石油化学研究院

Changwei Liu
PhD,Institute of Petrochemistry Heilongjiang Academy of Sciences

14:30-15:00

罗曼化学反应型胶带解决方案
Lohmann Reactive Tapes Solution

胡海彦
亚太区技术支持经理,罗曼胶带技术(天津)有限公司

Fiona Hu
Manager of Application Engineering, Asia Pacific
Lohmann Adhesive Tape Technologies Tianjin Co., Ltd.

15:00-15:30

结构粘接在消费电子行业中的应用
The Application of Structural Adhesive In Consumer Electronics Industry

黄冰
研发部副主任/博士,康达新材

Bing Huang
PhD/Deputy Director of R&D Department,Kangda New Materials

15:30-16:00

5G手机胶粘功能性材料需求及解决方案
The requirements and solutions for 5G mobile phone adhesive functional material

阮镜棠
研发经理,东莞市澳中电子材料有限公司

Jingtang Ruan
R&D Manager ,Dongguan Aozon Electronic Material Co., Ltd.

16:00-16:30

高性能导电胶在电子封装的应用 
The Application of High-Performance Conductive Adhesive in Electronic Packaging Process

焦柯嘉
首席专家/博士,北京中科纳通电子技术有限公司

Kejia Jiao
Chief Expert /PhD ,Nano Top Electronic Technology Co., Ltd.

扫码报名:2020(第三届)中国消费电子胶粘材料技术与应用创新论坛

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