Why Semiconductor & Precision Manufacturing Leaders Are Heading to FILM & TAPE EXPO 2025
As the global semiconductor and precision manufacturing industries face increasing demands for performance, miniaturization, and reliability, advanced film and tape technologies are becoming mission-critical. At FILM & TAPE EXPO 2025, taking place October 28–30 in Shenzhen, visitors will discover the materials and solutions that are reshaping next-gen microelectronics.
The show brings together over 3,500 leading suppliers across the functional film and adhesive supply chain, including those specializing in:
With the exponential growth in chip complexity and packaging innovation (like FOWLP, 2.5D/3D IC, etc.), engineers and sourcing teams are prioritizing material innovation — and FILM & TAPE EXPO 2025 is where they find it.
A dedicated High-Performance Materials Zone and Smart Die-Cutting Zone will showcase breakthroughs in ultra-thin PI film, high-purity polyesters, and automation-ready converting solutions — all designed for cleanroom and semiconductor-grade production environments.
Whether you’re in materials R&D, advanced packaging, or precision equipment integration, this is your chance to explore solutions that drive reliability, efficiency, and performance.
👉 Pre-register now to secure your badge and join 165,000+ professionals across electronics, automotive, energy, and semiconductors.
🔗 http://isclick.cn/ADC5E
Contact Us:
Contact Us:
For Exhibit:
Mr. Edison Li
For Visit:
Mr. Sam Jia
